eSUN ePLA-ST

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900 EGP

eSUN ePLA-ST is a tough PLA filament with high impact resistance, strong layer bonding, and excellent printability, ideal for durable and precise 3D printing applications.

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Description

eSUN ePLA-ST

eSUN ePLA-ST is a high-performance tough PLA filament engineered for applications that require strength, durability, and precision. Designed as an upgraded PLA material, it combines the easy printability of traditional PLA with enhanced mechanical properties, making it suitable for functional parts and engineering use.


Key Features

  • High Impact Resistance
    Engineered to withstand mechanical stress and shocks, making it ideal for durable printed parts.
  • Enhanced Toughness (Better than PETG)
    Offers superior toughness compared to PETG while maintaining easier printability similar to PLA.
  • High Elongation at Break
    Improved flexibility reduces brittleness and prevents cracking under load.
  • Strong Layer Adhesion
    Excellent interlayer bonding ensures structural integrity and reliability in printed models.
  • High Printing Accuracy
    Maintains fine details and dimensional precision, suitable for complex and technical designs.
  • Excellent Printability
    Low warping and consistent extrusion make it easy to print across a wide range of FDM printers.

Technical Specifications

  • Material Type: Tough PLA (ePLA-ST)
  • Diameter: 1.75 mm
  • Net Weight: 1 kg / spool

Mechanical Properties

  • Density: 1.25 g/cm³
  • Tensile Strength (XY): 38.4 MPa
  • Tensile Strength (Z): 22.52 MPa
  • Elongation at Break (XY): 24.05%
  • Elongation at Break (Z): 2.76%
  • Flexural Strength (XY): 59.9 MPa
  • Flexural Strength (Z): 37.4 MPa
  • Flexural Modulus (XY): 2512.41 MPa
  • Flexural Modulus (Z): 2459.45 MPa
  • IZOD Impact Strength (XY): 30.73 kJ/m²
  • IZOD Impact Strength (Z): 3.79 kJ/m²

Thermal Properties

  • Heat Distortion Temperature: 52°C
  • Melt Flow Index: 3.2 (190°C / 2.16 kg)

Recommended Printing Settings

  • Extruder Temperature: 200–230°C
  • Bed Temperature: 45–60°C
  • Printing Speed: < 200 mm/s
  • Fan Speed: 100%
  • Heated Bed: Required

Applications

  • Mechanical Engineering Parts
  • Electrical & Electronic Components
  • Automotive Prototyping
  • Functional Prototypes & End-Use Parts

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Brand

Brand

eSUN

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